Organic light emitting device and method of manufacturing the same

ABSTRACT

Disclosed is an organic light emitting device and a method of manufacturing the same, wherein the organic light emitting device is decreased in its thickness, and also decreased in its radius of curvature so as to realize the flexible device, and the organic light emitting device comprising a first component including a first plurality of layers, the first plurality of layers including a thin film transistor layer deposited on a surface of a first substrate, an emitting component layer deposited on the thin film transistor layer, and a passivation layer deposited on the emitting component layer; a second component including a second plurality of layers that are deposited on a surface of a second substrate without using an adhesive; and an adhesion layer between the first component and the second component, the adhesion layer coupling together the first component and the second component.

CROSS REFERENCE TO RELATED APPLICATIONS

This application claims the benefit of Korean Patent Application No.10-2012-0122329 filed on Oct. 31, 2012, which is hereby incorporated byreference as if fully set forth herein.

BACKGROUND

1. Field of the Disclosure

The embodiments herein relate to an organic light emitting device, andmore particularly, to an organic light emitting device with a touchsensor.

2. Discussion of the Related Art

Among various flat display devices, a liquid crystal display (LCD)device has been widely used up to now. However, the LCD deviceinevitably requires a backlight unit, and also shows limitation inbrightness and contrast ratio. In contrast to the LCD device, an organiclight emitting device can emit light in itself, that is, the organiclight emitting device needs no additional backlight unit, and obtainsrelatively better brightness and contrast ratio. Thus, there is anincreasing interest for the organic light emitting device.

The organic light emitting device may include a cathode for injecting anelectron, an anode for injecting a hole, and a light emitting layerprovided between the cathode and the anode. In this case, the electrongenerated in the cathode and the hole generated in the anode areinjected into the inside of the light emitting layer, and the injectedelectron and hole combine to generate an exciton. When the generatedexciton falls from an excited state to a ground state, a light emittingstate occurs, whereby an image is displayed on the organic lightemitting device.

Generally, the organic light emitting device uses an input means such asmouse or key board. However, when the organic light emitting device isapplied to products such as navigation, mobile phone or PDA, a touchsensor is widely used, which allows a user to input information bydirectly touching a screen with a finger, a pen or the like.

Hereinafter, a related art organic light emitting device with a touchsensor will be described with reference to the accompanying drawings.

FIG. 1 is a cross sectional view illustrating a related art organiclight emitting device.

As shown in FIG. 1, the related art organic light emitting device mayinclude a lower substrate 10, a component layer 20, a barrier layer 30,a polarizing film 40, a touch sensor 50, an upper substrate 60, and anadhesive layer 70.

The lower substrate 10 is generally formed of glass. However, in orderto realize a flexible organic light emitting device, which is capable ofbeing bent or curved, the lower substrate 10 may be formed oftransparent plastic material.

The component layer 20 is formed on the lower substrate 10, wherein thecomponent layer 20 corresponds to a layer for performing a main functionof the organic light emitting device for displaying an image. Thecomponent layer 20 may include a thin film transistor and an emittingcomponent.

The barrier layer 30 is formed on the component layer 20, wherein thebarrier layer 30 prevents external water or moisture from beingpermeated into the component layer 20.

The polarizing film 40 is formed on the barrier layer 30, wherein thepolarizing film 40 prevents a reflection of external light. That is,when the external light is incident on the upper substrate 60, and isthen provided to the inside of the organic light emitting device, thelight may be reflected on a plurality of electrodes or lines formedinside the component layer 20, which might cause a viewer'sinconvenience for watching a displayed image. According as thepolarizing film 40 is applied to the organic light emitting device, itis possible to prevent the reflection of external light. The polarizingfilm 40 performing this function may be generally formed of a circularpolarizing plate.

The touch sensor 50 is formed on the polarizing film 40. The touchsensor 50 may include a first touch sensor 50 a for sensing a touchposition in the X-axis direction, and a second touch sensor 50 b forsensing a touch position in the Y-axis direction. Each of the firsttouch sensor 50 a and the second touch sensor 50 b includes a touchelectrode provided with a predetermined pattern on a base film.

The upper substrate 60, which is provided in the uppermost surface ofthe organic light emitting device, protects the organic light emittingdevice.

The adhesive layer 70 may include a first adhesive layer 70 a, a secondadhesive layer 70 b, a third adhesive layer 70 c, and a fourth adhesivelayer 70 d. First, the polarizing film 40 adheres to the barrier layer30 by the use of first adhesive layer 70 a, the first touch sensor 50 aadheres to the polarizing film 40 by the use of second adhesive layer 70b, the second touch sensor 50 b adheres to the first touch sensor 50 aby the use of third adhesive layer 70 c, and the upper substrate 60adheres to the second touch sensor 50 b by the use of fourth adhesivelayer 70 d. That is, since the polarizing film 40, the first touchsensor 50 a, the second touch sensor 50 b, and the upper substrate 60are manufactured in a separate unit, it inevitably requires the adheringprocess for combining the above separately-manufactured componentstogether by the use of additional adhesive.

However, the related art organic light emitting device has the followingdisadvantages.

As mentioned above, the related art organic light emitting deviceincludes the plurality of separately-manufactured components, and thusit also needs the plurality of adhesive layers such as the firstadhesive layer 70 a, the second adhesive layer 70 b, the third adhesivelayer 70 c, and the fourth adhesive layer 70 d.

According as the number of adhesive layers is increased, a thickness ofthe organic light emitting device is also increased so that it isdifficult to realize the organic light emitting device with a thinprofile. Due to the increased thickness of the organic light emittingdevice, a radius of curvature is increased in the organic light emittingdevice, whereby it is difficult to realize the flexible organic lightemitting device which is capable of being bent or curved with easiness.

SUMMARY

Accordingly, the embodiments herein are directed to an organic lightemitting device and a method of manufacturing the same thatsubstantially obviate one or more problems due to limitations anddisadvantages of the related art.

An aspect of the embodiments herein are directed to providing an organiclight emitting device which minimizes the number of adhesive layers, anda method of manufacturing the same.

Additional advantages and features of embodiments of the invention willbe set forth in part in the description which follows and in part willbecome apparent to those having ordinary skill in the art uponexamination of the following or may be learned from practice ofembodiments of the invention. The objectives and other advantages ofembodiments of the invention may be realized and attained by thestructure particularly pointed out in the written description and claimshereof as well as the appended drawings.

To achieve these and other advantages and in accordance with the purposeof embodiments of the invention, as embodied and broadly describedherein, there is provided an organic light emitting device comprising afirst component including a first plurality of layers, the firstplurality of layers including a thin film transistor layer deposited ona surface of a first substrate, an emitting component layer deposited onthe thin film transistor layer, and a passivation layer deposited on theemitting component layer; a second component including a secondplurality of layers that are deposited on a surface of a secondsubstrate without using an adhesive; and an adhesion layer between thefirst component and the second component, the adhesion layer couplingtogether the first component and the second component.

In another aspect of embodiments herein, there is provided a method ofmanufacturing an organic light emitting device that may include forminga first component including a first plurality of layers, the firstplurality of layers including a thin film transistor layer deposited ona surface of a first substrate, an emitting component layer deposited onthe thin film transistor layer, and a passivation layer deposited on theemitting component layer; forming a second component including a secondplurality of layers that are deposited on a surface of a secondsubstrate without using an adhesive; and forming an adhesion layerbetween the first component and the second component, the adhesion layercoupling together the first component and the second component.

It is to be understood that both the foregoing general description andthe following detailed description of embodiments of the presentinvention are exemplary and explanatory and are intended to providefurther explanation of the invention as claimed.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, which are included to provide a furtherunderstanding of the invention and are incorporated in and constitute apart of this application, illustrate embodiment(s) of the invention andtogether with the description serve to explain the principle of theinvention. In the drawings:

FIG. 1 is a cross sectional view illustrating a related art organiclight emitting device;

FIG. 2 is a cross sectional view illustrating an organic light emittingdevice according to one embodiment;

FIG. 3A is a plane view of a touch sensor according to one embodiment,and FIG. 3B is a cross sectional view along I-I of FIG. 3A;

FIG. 4 illustrates a method of determining an adhesive layer to preventa light leakage between each of neighboring pixels in the organic lightemitting device according to one embodiment;

FIG. 5 is a cross sectional view illustrating an organic light emittingdevice according to another embodiment; and

FIGS. 6A to 6E are cross sectional views illustrating a method ofmanufacturing the organic light emitting device according to oneembodiment.

DETAILED DESCRIPTION

Reference will now be made in detail to the exemplary embodiments of thepresent invention, examples of which are illustrated in the accompanyingdrawings. Wherever possible, the same reference numbers will be usedthroughout the drawings to refer to the same or like parts.

On explanation about the embodiments herein, when it is mentioned that afirst element is positioned “on” a second structure, it should beunderstood that the first and second elements are brought into contactwith each other, or a third element is interposed between the first andsecond elements.

Also, the term of “deposition” denotes that a layer is formed withoutusing an additional adhesive, for example, the layer is formed by avapor deposition method such as CVD (Chemical Vapor Deposition) or PVD(Physical Vapor Deposition), or by coating a solution.

Hereinafter, the embodiments will be described in detail with referenceto the accompanying drawings.

FIG. 2 is a cross sectional view illustrating an organic light emittingdevice according to one embodiment.

As shown in FIG. 2, the organic light emitting device according to oneembodiment may include a lower component 101, an upper component 201,and an adhesive layer 300 provided for adhesion of the lower component101 and the upper component 201.

The lower component 101 may include a lower substrate 100, a lowerbarrier layer 110, a thin film transistor layer 120, an emittingcomponent layer 130, a passivation layer 140, and a lower surfacereinforcing layer 150.

The lower substrate 100 may be formed of transparent plastic materialcapable of being bent or curved, for example, polyimide, but it is notlimited to this material. For example, the lower substrate 100 may beformed of glass. If the lower substrate 100 is formed of polyimide, itis preferable to use heat-resistant polyimide, which is capable ofenduring a high temperature, in consideration of a high-temperaturedeposition process on the lower substrate 100.

The lower barrier layer 110 is deposited on one surface of the lowersubstrate 100, and more particularly, on an upper surface of the lowersubstrate 100 confronting the adhesive layer 300. The lower barrierlayer 110 prevents external water or moisture from being permeated intothe emitting component layer 130, and also prevents elements included inthe lower substrate 100 from spreading toward the thin film transistorlayer 120. The lower barrier layer 110 may be formed of silicon oxide orsilicon nitride deposited by CVD (Chemical Vapor Deposition).

The thin film transistor layer 120 is deposited on the lower barrierlayer 110. The thin film transistor layer 120 may include a plurality oflines such as gate lines, data lines and power lines, and a switchingthin film transistor and a driving thin film transistor connected withthe plurality of lines. Also, a capacitor may be formed by combinationof the lines and electrodes of the thin film transistor. The above linesand thin film transistor constituting the thin film transistor layer 120may be changed to various types generally known to those in the art.

The emitting component layer 130 is deposited on the thin filmtransistor layer 120. The emitting component layer 130 may include abank layer 131, a lower electrode 132, an organic light emitting layer133, and an upper electrode 134.

The bank layer 131 is deposited on the thin film transistor layer 120,especially, the remaining regions except a pixel region. That is, thepixel region for displaying an image is surrounded by the bank layer131. The bank layer 131 is formed of an organic insulating material, forexample, polyimide, photo acryl, or benzocyclobutene (BCB), but notlimited to these materials.

The lower electrode 132 is deposited on the thin film transistor layer120, especially, the pixel region surround by the bank layer 131. Thatis, the lower electrode 132 is provided with a plurality of patternswhich are respectively positioned in the plurality of pixel regions andare insulated from one another. The lower electrode 132 is electricallyconnected with the driving thin film transistor provided in the thinfilm transistor layer 120.

The organic light emitting layer 133 is deposited on the lower electrode132. The organic light emitting layer 133 may be formed by sequentiallydepositing a hole injecting layer, a hole transporting layer, anemitting layer, an electron transporting layer, and an electroninjecting layer. In this case, it is possible to omit one or more layersamong the hole injecting layer, the hole transporting layer, theelectron transporting layer and the electron injecting layer except thelight emitting layer. The above deposition structure of the plurallayers included in the organic light emitting layer 133 may be changedin various ways generally known to those in the art. As the organiclight emitting device may include an additional color filter layer to bedescribed, there may be no need to emit color light in each pixel,whereby the organic light emitting layer 133 provided in each pixel maybe configured to emit white-color light, but not necessarily. Theorganic light emitting layer 133 may be configured to separately emitred-color light, green-color light and blue-color light in therespective pixels. The structure and material for the organic lightemitting layer 133 may be changed in various ways generally known tothose in the art.

The upper electrode 134 is deposited on the organic light emitting layer133. The upper electrode 134 may function as a common electrode, wherebythe upper electrode 134 may be formed on the bank layer 131 as well asthe organic light emitting layer 133.

The passivation layer 140 is deposited on the emitting component layer130, and more particularly, the upper electrode 134, wherein thepassivation layer 140 protects the emitting component layer 130.

The lower surface reinforcing layer 150 is formed on the other surfaceof the lower substrate 100, and more particularly, a lower surface ofthe lower substrate 100. The lower surface reinforcing layer 150 isprovided to improve the mechanical properties of a finally-manufacturedproduct. The lower surface reinforcing layer 150 may be deposited on theother surface of the lower substrate 100 by a coating process, or may beformed in a film type adhered to the other surface of the lowersubstrate 100. In order to minimize a adhesion process, it is preferablethat the lower surface reinforcing layer 150 be deposited on the othersurface of the lower substrate 100 by the coating process. Forminimizing a thickness of the organic light emitting device, it ispossible to omit the lower surface reinforcing layer 150.

As described above, all of the lower barrier layer 110, the thin filmtransistor layer 120, the emitting component layer 130 and thepassivation layer 140 constituting the lower component 101 may besequentially deposited on one surface of the lower substrate 100 withoutusing an additional adhesive layer. Thus, it is possible to prevent thelower component 101 from being thick, and also to simplify amanufacturing process.

The upper component 201 may include an upper substrate 200, an upperbarrier layer 210, a touch sensor 220, a light-shielding layer 230, acolor filter layer 240, and a reflection preventing layer 250.

The upper substrate 200 may be formed of transparent plastic materialcapable of being bent or curved, for example, polyimide, but it is notlimited to this material. For example, the upper substrate 200 may beformed of glass.

The upper barrier layer 210 is deposited on one surface of the uppersubstrate 200, and more particularly, a lower surface of the uppersubstrate 200 confronting the adhesive layer 300. Like theaforementioned lower barrier layer 110, the upper barrier layer 210prevents external water or moisture from being permeated into theorganic light emitting device, and also prevents elements included inthe upper substrate 200 from spreading toward the touch sensor 220. Theupper barrier layer 210 may be formed of silicon oxide or siliconnitride.

The touch sensor 220 is deposited on the upper barrier layer 210. Incase of the related art, the touch sensor is manufactured by forming atouch electrode with a predetermined pattern on an additional base madeof glass or plastic substrate. Thus, the related art touch sensor whichis the separately-manufactured component adheres to another component ofthe organic light emitting device through the use of adhesive. However,in case of the present invention, the touch sensor 220 is manufacturedby depositing a touch electrode with a predetermined pattern on theupper barrier layer 210 functioning as a base without using anadditional glass or plastic substrate. According to the embodimentsherein, there is no need for the additional adhesive to form the touchsensor 220, whereby it is possible to prevent a thickness of organiclight emitting device from being increased, and also to simplify amanufacturing process.

The touch sensor 220 comprises the touch electrode deposited on theupper barrier layer 210. In the embodiments herein, a first touchelectrode for sensing a touch position in the X-axis direction and asecond touch electrode for sensing a touch position in the Y-axisdirection may be formed at the same layer.

FIGS. 3A and 3B illustrate the touch sensor 220 according to oneembodiment, wherein the first touch electrode and the second touchelectrode are formed at the same layer. FIG. 3A is a plane view of thetouch sensor, and FIG. 3B is a cross sectional view along I-I of FIG.3A.

As shown in FIG. 3A, the touch sensor 220 according to one embodimentmay include a first touch electrode 221, a second touch electrode 223,and a bridge electrode 301.

The plurality of first touch electrodes 221 may be provided at fixedintervals in the horizontal and vertical directions. As shown in thedrawings, the first touch electrode 221 may be formed in a diamondshape, but it is not limited to this shape. Also, the neighboring two offirst touch electrodes 221 provided at the fixed interval in thevertical direction are electrically connected with each other throughthe bridge electrode 301. According to the connection of the first touchelectrode 221 and the bridge electrode 301, it is possible to obtain theelectrical connection for the plurality of first touch electrode 221 inthe vertical direction. In this case, the bridge electrode 301 preventsa short between the first touch electrode 221 and the second touchelectrode 223, and connects the first touch electrodes 221 in thevertical direction. The structure of the bridge electrode 301 will bereadily understood with reference to the following cross sectional viewof FIG. 3B.

The second touch electrode 223 is formed in an electrode structureextending in the horizontal direction. In more detail, the second touchelectrode 223 may include a diamond-shape structure 223 a providedbetween each of the first touch electrodes 221, and a connectionstructure 223 b for connection of the diamond-shape structures 223 a,wherein the connection structure 223 b is overlapped with the bridgeelectrode 301. The diamond-shape structure 223 a and the connectionstructure 223 b are formed as one body. The diamond-shape structure 223a may be changed to a shape corresponding to the first touch electrode221.

Thus, it is possible to obtain the electrode structure extending in thevertical direction according to the connection of the first touchelectrode 221 and the bridge electrode 301, and also to obtain theelectrode structure extending in the horizontal direction by the secondtouch electrode 223, thereby sensing a user's touch position in theX-axis direction and the Y-axis direction.

As shown in FIG. 3B, the plurality of first touch electrodes 221 areprovided at fixed intervals on the upper barrier layer 210, and theconnection structure 223 b constituting the second touch electrode 223is formed between the two of first touch electrodes 221 provided at thefixed interval. That is, the first touch electrode 221 and the secondtouch electrode 223 are patterned together on the upper barrier layer210.

On the connection structure 223 b constituting the second touchelectrode 223, there is an insulating layer 222. Owing to the insulatinglayer 222, the first touch electrode 221 is insulated from the secondtouch electrode 223.

The bridge electrode 301 is formed on the insulating layer 222. Thebridge electrode 301 is connected with the two of first touch electrodes221 provided at the fixed interval, whereby the two of first touchelectrodes 221 are electrically connected with each other through thebridge electrode 301.

The above touch sensor shown in FIGS. 3A and 3B corresponds to the touchsensor according to one embodiment. However, the touch sensor accordingis not limited to the above structure shown in FIGS. 3A and 3B. Thetouch sensor may include various kinds of touch sensors, which arecapable of being deposited on the upper barrier layer 210 without usingthe additional base, generally known to those in the art. For example,the touch sensor may use the touch sensor of infrared scanning type orultrasound surface acoustic wave type.

Referring once again to FIG. 2, the light-shielding layer 230 isdeposited on the touch sensor 220. The light-shielding layer 230prevents the light from leaking in the remaining regions except thepixel region, wherein the light-shielding layer 230 is overlapped withthe aforementioned bank layer 131.

The color filter layer 240 is deposited on the touch sensor 220, andmore particularly, the pixel region between each of the light-shieldinglayers 230. The color filter layer 240 may include red (R), green (G)and blue (B) color filters.

The color filter layer 240 is provided to realize a full-color image onthe organic light emitting device. Also, the color filter layer 240,together with the light-shielding layer 230, reduces the reflection ofexternal light, whereby it enables to remove a polarizing film forpreventing the reflection of external light, thereby decreasing athickness of the organic light emitting device. In more detail, when theexternal light is incident on the organic light emitting device, theexternal light is absorbed in the light-shielding layer 230, to therebydecrease the reflection of external light. Also, when the external lightis provided to the inside of the organic light emitting device, thecolor filter layer 240 enables to transmit only light with apredetermined wavelength range (for example, red, green or blue light),that is, the color filter layer 240 prevents the light with theremaining wavelength ranges except the predetermined wavelength rangefrom being transmitted therethrough, thereby reducing the reflection ofexternal light. For example, if the light passing through the red colorfilter layer 240 is reflected on the lower component 101 and isrefracted to the green or blue color filter layer 240, the lightprogress is prevented by the color filter layer 240, to thereby reducethe reflection of external light.

As shown in an expanded part of FIG. 2, a planarization layer 225 may beadditionally deposited on the touch sensor 220, and more particularly,between the touch sensor 220 and the light-shielding layer 230, andbetween the touch sensor 220 and the color filter layer 240. That is, asdescribed above, since the touch sensor 220 is provided with theplurality of touch electrodes with the predetermined pattern, the touchsensor 220 might have a step coverage due to its structure. In thiscase, it may be difficult to deposit the light-shielding layer 230 andthe color filter layer 240 on the touch sensor 220 with the stepcoverage. Thus, in order to overcome a problem caused by the stepcoverage, the planarization layer 225 may be additionally provided.However, if needed, it is possible to omit the planarization layer 225.

The reflection preventing layer 250 is formed on the other surface ofthe upper substrate 200, and more particularly, the upper surface of theupper substrate 200. The reflection preventing layer 250 prevents thereflection of external light. As described above, the reflection ofexternal light provided to the inside of the organic light emittingdevice is reduced by the light-shielding layer 230 and the color filterlayer 240. In addition, the reflection preventing layer 250 may beprovided so as to prevent the external light from being reflected on thesurface of the organic light emitting device. The reflection preventinglayer 250 may be deposited on the other surface of the upper substrate200 by a coating process for the reflection prevention generally knownto those in the art, or may be formed in a film type adhered to theother surface of the upper substrate 200, if needed.

As explained above, the upper barrier layer 210, the touch sensor 220,the light-shielding layer 230, and the color filter layer 240, whichconstitute the upper component 201, may be sequentially deposited on onesurface of the upper substrate 200 without using additional adhesivelayers. Accordingly, it is possible to prevent a thickness of the uppercomponent 201 from being increased by the adhesive layer, and also toprevent a manufacturing process from being complicated.

The adhesive layer 300 is formed between the lower component 101 and theupper component 201, and more particularly, between the passivationlayer 140 for the lower component 101 and the color filter layer 240 forthe upper component 201, wherein the adhesive layer 300 functions as anadhesive between the lower component 101 and the upper component 201.

The adhesive layer 300 may be formed in a film structure such asdouble-sided tape, or may be formed by coating a liquid adhesivematerial such as sealant and curing the coated material.

The increased thickness of the adhesive layer 300 causes the increase inthickness of the organic light emitting device, and also might causelight leakage in the region between each of the neighboring pixels. Thethickness of the adhesive layer 300 is determined in consideration of atotal thickness of the organic light emitting device and a light leakageprevention. Hereinafter, a method of determining the thickness of theadhesive layer 300 in consideration of the light leakage prevention willbe described in detail as follows.

FIG. 4 illustrates a method of determining the thickness of the adhesivelayer 300 to prevent the light leakage between each of neighboringpixels in the organic light emitting device according to one embodiment.

As shown in FIG. 4, the bank layer 131 for the lower component (See‘101’ of FIG. 2) is overlapped with the light-shielding layer 230 forthe upper component (See ‘201’ of FIG. 2). In this case, on theassumption that a maximum viewing angle capable of preventing the lightleakage between each of the neighboring pixel, that is, preventing thelight emitted from one pixel from preceding to the neighboring pixel is‘θ’, the following Equations 1 to 3 are established,T1=A×tan(90−θ)/2  Equation 1T2=B×tan(90−θ)/2  Equation 2T=T1+T2=(A+B)×tan(90−θ)/2  Equation 3wherein, ‘A’ is a width of the bank layer 131, ‘B’ is a width of thelight-shielding layer 230, and ‘T’ is a distance between the bank layer131 and the light-shielding layer 230.

As known from the above Equation 3, the distance ‘T’ between the banklayer 131 and the light-shielding layer 230 is determined by the width‘A’ of the bank layer 131 and the width ‘B’ of the light-shielding layer230 when the maximum viewing angle ‘θ’ is set to a predetermined value.For example, if the maximum viewing angle ‘θ’ is set to 60°, thedistance ‘T’ between the bank light 131 and the light-shielding layer230 is about (A+B)/3.464.

Referring to FIG. 2, the color filter layer 240, the adhesive layer 300,the passivation layer 140 and the upper electrode 134 are formed betweenthe bank layer 131 and the light-shielding layer 230. Thus, if thedistance ‘T’ between the bank layer 131 and the light-shielding layer230 is determined, the thickness of the adhesive layer 300 is determinedin consideration of the thickness of the remaining layers except theadhesive layer 300 in the distance ‘T’ between the bank layer 131 andthe light-shielding layer 230. Thus, it is possible to determine thethickness of the adhesive layer 300 so as to prevent the light leakagebetween each of the neighboring pixels.

FIG. 5 is a cross sectional view illustrating an organic light emittingdevice according to another embodiment. Except that a touch sensor 220,a light-shielding layer 230 and a color filter layer 240 included in anupper component 201 are changed in their positions, the organic lightemitting device of FIG. 5 is identical in structure to the organic lightemitting device of FIG. 2. Thus, the same reference numbers will be usedthroughout the drawings to refer to the same or like parts, and thedetailed explanation for the same parts will be omitted, that is, onlythe different parts will be described.

As shown in FIG. 5, a light-shielding layer 230 and a color filter layer240 are deposited on an upper barrier layer 210, and more particularly,a lower surface of the upper barrier layer 210. The light-shieldinglayer 230 is formed in the remaining regions except the pixel region,and the color filter layer 240 is formed in the pixel region.

Then, a touch sensor 220 is deposited on the color filter layer 240. Asshown in an expanded part of FIG. 5, a planarization layer 225 may beadditionally deposited on the color filter layer 240, and moreparticularly, between the color filter layer 240 and the touch sensor220.

Unlike the aforementioned embodiment of the present invention, anadhesive layer 300 is formed between a passivation layer 140 for a lowercomponent 101 and the touch sensor 220 for an upper component 201.

FIGS. 6A to 6E are cross sectional views illustrating a method ofmanufacturing the organic light emitting device according to oneembodiment, which relate with a method of manufacturing the organiclight emitting device of FIG. 2.

As shown in FIG. 6A, the lower component 101 is formed on a first glasssubstrate 1.

When the lower substrate 100 for the lower component 101 is formed oftransparent plastic capable of being bent or curved, operations such astransfer processes which are repetitively performed for a manufacturingprocess might be difficult. For this reason, the lower component 101 isformed on the first glass substrate 1 in consideration of conveniencefor the operations such as the transfer processes, and the first glasssubstrate 1 is separated from the lower component 101 for the followingprocess.

A first sacrificing layer 1 a is deposited on the first glass substrate1, and the lower component 101 is formed on the first sacrificing layer1 a. The first sacrificing layer 1 a enables to fix the lower component101 to the first glass substrate 1, and enables to easily separate thefirst glass substrate 1 from the lower component 101 for the followinglaser separation process. The first sacrificing layer 1 a may be formedof hydrogenated amorphous silicon (a-Si:H) by CVD (Chemical VaporDeposition).

If using the lower substrate 100 of glass substrate, there is no need toadditionally provide the first glass substrate 1 and the firstsacrificing layer 1 a.

The process of forming the lower component 101 will be described in moredetail. First, the lower substrate 100 adheres to the first sacrificinglayer 1 a, the lower barrier layer 110 is deposited on the lowersubstrate 100, and the thin film transistor layer 120 is deposited onthe lower barrier layer 110. Then, the emitting component layer 130including the bank layer 131, the lower electrode 132, the organic lightemitting layer 133, and the upper electrode 134 is deposited on the thinfilm transistor layer 120. Thereafter, the passivation layer 140 isdeposited on the emitting component layer 130.

The above process of forming the lower component 101 may comprise a thinfilm deposition process such as CVD (Chemical Vapor Deposition), PVD(Physical Vapor Deposition), and a coating method, or comprise acombination of the thin film deposition process and a patterning processsuch as photolithography.

As shown in FIG. 6B, the upper component 201 is formed on a second glasssubstrate 2.

When the upper substrate 200 for the upper component 201 is formed oftransparent plastic capable of being bent or curved, the second glasssubstrate 2 is applied thereto. Meanwhile, if using the upper substrate200 of glass substrate, there is no need to additionally provide thesecond glass substrate 2.

A second sacrificing layer 2 a is deposited on the second glasssubstrate 2, and the upper component 201 is formed on the secondsacrificing layer 2 a. Like the first sacrificing layer 1 a, the secondsacrificing layer 2 a may be formed of hydrogenated amorphous silicon(a-Si:H) by CVD (Chemical Vapor Deposition).

The process of forming the upper component 201 will be described in moredetail. First, the upper substrate 200 adheres to the second sacrificinglayer 2 a, the upper barrier layer 210 is deposited on the uppersubstrate 200, the touch sensor 220 is deposited on the upper barrierlayer 210, and then the light-shielding layer 230 and the color filterlayer 240 are deposited on the touch sensor 220.

Although not shown, the light-shielding layer 230 and the color filterlayer 240 are deposited on the upper barrier layer 210, and the touchsensor 220 is deposited on the color filter layer 240, therebymanufacturing the organic light emitting device of FIG. 5.

The above process of forming the upper component 201 may comprise a thinfilm deposition process such as CVD (Chemical Vapor Deposition), PVD(Physical Vapor Deposition), and a coating method, or comprise acombination of the thin film deposition process and a patterning processsuch as photolithography.

Then, as shown in FIG. 6C, under the condition that the lower component101 and the upper component 201 confront each other, the lower component101 and the upper component 201 adhere to each other through the use ofadhesive layer 300.

This process may comprise adhering the film structure such asdouble-sided tape to any one of the lower component 101 and the uppercomponent 201 or coating the liquid adhesive material such as sealant onany one of the lower component 101 and the upper component 201.

As shown in FIG. 6D, the first glass substrate 1 is separated from thelower component 101, and the second glass substrate 2 is separated fromthe upper component 201.

The process of separating the first glass substrate 1 and the secondglass substrate 2 may be performed by the laser irradiation process. Bythe laser irradiation, hydrogen gas (H₂) is generated from thehydrogenated amorphous silicon (a-Si:H) of the first sacrificing layer 1a and the second sacrificing layer 2 a, whereby the first glasssubstrate 1 is separated from the lower component 101 due to the weakadhesion therebetween and the second glass substrate 2 is separated fromthe upper component 201 due to the weak adhesion therebetween.

However, the process of separating the first glass substrate 1 and thesecond glass substrate 2 is not limited to the laser irradiationprocess. That is, various methods generally known to those in the artmay be applied to separate the first glass substrate 1 and the secondglass substrate 2.

As shown in FIG. 6E, the lower surface reinforcing layer 150 is formedon the lower surface of the lower substrate 100, and the reflectionpreventing layer 250 is formed on the upper surface of the uppersubstrate 200, thereby realizing the complete organic light emittingdevice according to one embodiment of the present invention.

According to the organic light emitting device of the embodimentsherein, the thin film transistor layer 120, the emitting component layer130 and the passivation layer 140 are deposited on one surface of thelower substrate 100 without using the additional adhesive, and the touchsensor 220, the light-shielding layer 230 and the color filter layer 240are deposited on one surface of the upper substrate 200 without usingthe additional adhesive so that it is possible to decrease the number ofadhesive layers in comparison to the related art. Thus, the organiclight emitting device according to the present invention is decreased inits thickness, and also decreased in its radius of curvature, therebyrealizing the flexible organic light emitting device.

It will be apparent to those skilled in the art that variousmodifications and variations can be made to embodiments of the presentinvention without departing from the spirit or scope of the invention.Thus, it is intended that the present invention covers the modificationsand variations of this invention provided they come within the scope ofthe appended claims and their equivalents.

What is claimed is:
 1. An organic light emitting device comprising: afirst component including a first plurality of layers, the firstplurality of layers including a thin film transistor layer deposited ona surface of a first substrate, an emitting component layer deposited onthe thin film transistor layer, and a passivation layer deposited on theemitting component layer; a second component including a secondplurality of layers, the second plurality of layers deposited on asurface of a second substrate without an adhesive contacting the surfaceof the second substrate and at least one of the second plurality oflayers, the second plurality of layers including a touch sensordeposited on the second substrate and a color filter layer deposited onthe touch sensor or the second plurality of layers including the colorfilter layer deposited on the second substrate and the touch sensordeposited on the color filter layer; and an adhesion layer between thefirst component and the second component, the adhesion layer couplingtogether the first component and the second component.
 2. The organiclight emitting device of claim 1, wherein the first component furthercomprises a first barrier layer deposited between the first substrateand the thin film transistor layer, and wherein the second componentfurther comprises a second barrier layer deposited between the secondsubstrate and the touch sensor.
 3. The organic light emitting device ofclaim 1, wherein the emitting component layer of the first componentincludes a bank layer that overlaps a light-shielding layer included inthe color filter layer of the second component.
 4. The organic lightemitting device of claim 3, wherein a distance (T) between thelight-shielding layer and the bank layer satisfies the followingequation:$T = {\left( {A + B} \right) \cdot \frac{\tan\left( {90 - \theta} \right)}{2}}$wherein A is a width of the bank layer, B is a width of thelight-shielding layer, and θ is a maximum viewing angle for preventinglight leakage between each neighboring pixel of the organic lightemitting device.
 5. The organic light emitting device of claim 1,wherein the second component further includes a reflection preventinglayer deposited on another surface of the second substrate.
 6. Theorganic light emitting device of claim 1, wherein the first componentfurther includes a reinforcement layer deposited on another surface ofthe first substrate.
 7. The organic light emitting device of claim 1,further comprising: a planarization layer deposited between the colorfilter layer and the touch sensor.